Automated Chiplet Packaging Solution | Integrated Line Process: Vision Dispensing, Laser Cleaning & Automatic Tray Handling

Integrated Automated Chiplet Packaging Solution by Highwah

With the rapid iteration of advanced packaging technologies, Chiplet packaging has become a core sector for semiconductor domestic substitution and chip performance upgrading. Traditional packaging modes featuring manual operation and segmented equipment are plagued by insufficient precision, low yield, limited production capacity, high labor costs and other drawbacks, unable to satisfy production demands for high-density, miniaturized Chiplet packaging. Drawing on years of R&D experience in semiconductor automation, Highwah (full corporate name: Shenzhen Highwah Intelligent Technology Ltd.) has developed an integrated automated solution for Chiplet packaging. Integrating three core devices — vision dispensing equipment, laser cleaning equipment and automatic tray loading & unloading equipment — the solution enables fully unmanned, high-precision and standardized production, perfectly adapting to small & medium batch sampling and mass production scenarios.

In the full Chiplet packaging workflow, the automatic tray loading & unloading machine undertakes core front-end processes. Equipped with a high-definition visual positioning system and vacuum pick-and-place module, Highwah’s automatic tray handler can accurately identify micro chiplets and special-shaped chips to complete fully automatic tray arrangement, loading and unloading. It supports rapid product changeover and is compatible with Chiplet products of various specifications. The device is built with an intelligent fault alarm function that eliminates full-time on-site operators, thoroughly resolving common defects from manual operation including misaligned placement, missing materials and chip collision & scratch damage, and greatly improving feeding stability and operational efficiency.

Dispensing is a critical process in Chiplet packaging, which directly determines the bonding stability, heat dissipation performance and service life of chips. Conventional dispensing equipment relies on fixture positioning, which brings strict placement restrictions and large dispensing deviation, easily triggering glue overflow or insufficient glue. Highwah’s panoramic vision dispensing machines and inline high-speed dispensing machines break free from traditional fixture constraints. They realize rapid recognition and positioning within one second regardless of product placement status, and are equipped with a precision glue control system to complete sophisticated dispensing processes such as Chiplet dam formation, underfill and encapsulation bonding. With micron-level dispensing accuracy, the equipment avoids glue shortage and overflow, fully meeting the process standards of advanced packaging.

Residual glue, excess materials and oxide contaminants generated during packaging are key hidden dangers dragging down packaging yield. Manual polishing and chemical cleaning tend to damage chip substrates, cause secondary pollution and suffer from low efficiency. Adopting precise visual positioning technology, Highwah’s vision-guided laser cleaner removes all types of post-packaging contaminants through non-contact treatment. It delivers damage-free, eco-friendly cleaning with micron-level precision, avoiding any harm to chiplets and wafers and effectively lifting packaging yield.

The complete automated Chiplet packaging line realizes linked full-process operations covering tray loading & unloading, precision dispensing, laser cleaning and automatic material collection, with intelligent visual monitoring throughout the whole workflow. Featuring high automation and stable operation, the system effectively reduces manual intervention, cuts production costs, and boosts production capacity and product yield. Widely applicable to all types of Chiplet packaging and advanced packaging & testing scenarios, the solution supports non-standard customization; customized turnkey production lines can be developed according to customers’ workshop layout, product specifications and process requirements.

Highwah (Shenzhen Highwah Intelligent Technology Ltd.) focuses on the R&D of automated equipment for semiconductors, 3C electronics and new energy industries. We provide free process evaluation, sample testing and non-standard production line customization services. If you require equipment selection guidance, process optimization or production line renovation solutions, please contact us to obtain exclusive customized proposals.